MicroGraph System MGS (MZU)
With the Modular System for Crimp Cross-Sectional Analysis, crimp cross-sectional images can created in a fraction of the time compared to conventional methods. The combined sawing-polishing process, innovative electrolyte staining process, and high precision optics result in high quality images for thorough analysis of the connection.
Electrical connections (e.g. crimped, welded, soldered or spliced) can be cut (sawn), polished, stained (cleaned), and visually analyzed. The system includes modular components that can be combined according to individual needs. Ergonomically designed work tables are also available to optimize workflow when combining the components in one area.
Attribute | Value | |
Model | MZU 1.3 MacroZoom Unit | |
Lens Coverage | 1.4 x 1.0 mm up to 9.1 x 6.8 mm |
Illumination | LED ring light |
Lens and Zoom | MacroZoom lens with 9 incremental zoom steps |
Camera | USB 2.0 camera |
Resolution | 1.3 Megapixel |
Operating Temperature | 0 – 50° C (32 – 120°F) |
Safety | IP20 |
Options | - Lens for 2.8 x 2.0 mm up to 18.2 x 13.2 mm
- Object micrometer for calibration of optics and camera
|
Electrical Connection | 100 – 240 V, 50/60 Hz, 200 VA |
Dimensions (W x D x H) | 200 x 255 x 40 mm |
Weight | ca. 1.7 kg |
CE - Conformity | The MZU 1.3 fully complies with all CE and EMC equipment guidelines relative to mechanical and electrical safety and electromagnetic compatibility |
For analysis and measuring, the CrimpLab® software is included in the scope of delivery. All required functions for professional measuring and administration of cross sectional views are standard. Calibrating the MZU 1.3 optics and software according to international norms using a micrometer is simple and quick.
Attribute | Value | |
Software | CrimpLab® | |
PC | IPM-compatible PC |
Processor | Pentium 3 |
Memory | min. 512 MB RAM |
Graphics Card | min. 32 MB |
Interface | USB 2.0 |
Operating System | Microsoft Windows® 2000, SP4; Microsoft Windows® XP, SP2; Microsoft Windows® Vista |